Invention Grant
- Patent Title: Integrated saw device heater
- Patent Title (中): 集成锯装置加热器
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Application No.: US11516873Application Date: 2006-09-06
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Publication No.: US07898365B2Publication Date: 2011-03-01
- Inventor: Mark A. Koehnke , Stephen J. Pereira
- Applicant: Mark A. Koehnke , Stephen J. Pereira
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Iandiorio Teska & Coleman
- Main IPC: H03H9/64
- IPC: H03H9/64
Abstract:
An integrated SAW device features an electronic assembly, a SAW device mounted to the electronic assembly, and a heater element on the SAW device to minimize thermal resistance between the SAW device and the heater element.
Public/Granted literature
- US20080055022A1 Integrated saw device heater Public/Granted day:2008-03-06
Information query
