Invention Grant
US07898370B2 Hybrid surface mountable packages for very high speed integrated circuits
有权
用于非常高速集成电路的混合表面安装封装
- Patent Title: Hybrid surface mountable packages for very high speed integrated circuits
- Patent Title (中): 用于非常高速集成电路的混合表面安装封装
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Application No.: US12340375Application Date: 2008-12-19
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Publication No.: US07898370B2Publication Date: 2011-03-01
- Inventor: Jianying Zhou , Yuheng Lee
- Applicant: Jianying Zhou , Yuheng Lee
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Workman Nydegger
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01P5/00
Abstract:
In one example, a hybrid surface mountable package includes a housing at least partially defining a sealed cavity, two microwave integrated circuits (MIC) chips positioned inside the sealed cavity, and a very-high-speed interconnect connecting the two MIC chips to each other. The very-high-speed interconnect includes strong coupling co-planar waveguide (CPWG) transmission lines.
Public/Granted literature
- US20090160583A1 HYBRID SURFACE MOUNTABLE PACKAGES FOR VERY HIGH SPEED INTEGRATED CIRCUITS Public/Granted day:2009-06-25
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