Invention Grant
- Patent Title: Back plate of backlight module and manufacturing method thereof
- Patent Title (中): 背光模块背板及其制造方法
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Application No.: US12204243Application Date: 2008-09-04
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Publication No.: US07898616B2Publication Date: 2011-03-01
- Inventor: Chia-Hsin Yu
- Applicant: Chia-Hsin Yu
- Applicant Address: TW Hsin-Chu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP
- Priority: TW96141042A 20071031
- Main IPC: G02F1/1335
- IPC: G02F1/1335 ; A47B81/00 ; G09G3/36 ; B21D31/00
Abstract:
A back plate includes an inner part, a bottom part, an outer part, a folded part and a fastener. The bottom part is connected to the inner part for providing a container space. The outer part is opposite the inner part. The folded part is connected with the outer part and the inner part. The fastener is disposed on the outer part. A method for manufacturing the back plate is also disclosed herein.
Public/Granted literature
- US20090108721A1 Back Plate of Backlight Module and Manufacturing Method Thereof Public/Granted day:2009-04-30
Information query
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