Invention Grant
US07898736B2 Hybrid optical/electronic structures fabricated by a common molding process
失效
通过普通成型工艺制造的混合光学/电子结构
- Patent Title: Hybrid optical/electronic structures fabricated by a common molding process
- Patent Title (中): 通过普通成型工艺制造的混合光学/电子结构
-
Application No.: US12143251Application Date: 2008-06-20
-
Publication No.: US07898736B2Publication Date: 2011-03-01
- Inventor: Lawrence Jacobowitz , Casimer DeCusatis
- Applicant: Lawrence Jacobowitz , Casimer DeCusatis
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: G02B27/10
- IPC: G02B27/10 ; G02B6/36

Abstract:
Disclosed is a method of fabricating a molded structure including both micro lenses and metallic pins. The method comprises the steps of providing a mold apparatus having a set of first cavities and a set of second cavities, depositing a first material in the first cavities to form a set of metallic pins, and depositing a second material in the second cavities to form a set of micro lenses. The formed molded structure comprises a substrate, a set of molded microlenses on said substrate, and a set of molded metallic pins on that same substrate. The metallic pins may be formed as alignment pins or as electrical connectors. The invention enables the micro lenses and metallic pins to be manufactured by way of molding on a common substrate for the first time.
Public/Granted literature
- US20080310799A1 HYBRID OPTICAL/ELECTRONIC STRUCTURES FABRICATED BY A COMMON MOLDING PROCESS Public/Granted day:2008-12-18
Information query