Invention Grant
- Patent Title: Heat dissipating structure for electronic component and display device
- Patent Title (中): 电子部件和显示装置的散热结构
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Application No.: US12325059Application Date: 2008-11-28
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Publication No.: US07898798B2Publication Date: 2011-03-01
- Inventor: Tatsuya Sakata , Toru Yamauchi , Kenichi Seki , Terutaka Yana
- Applicant: Tatsuya Sakata , Toru Yamauchi , Kenichi Seki , Terutaka Yana
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-308282 20071129
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipating structure for an electronic component of the present invention includes a main board on which electronic components are mounted, a heat sink disposed facing the main board and contacting a plurality of the electronic components on the main board, a heat pipe disposed on the heat sink, an arm branching from the heat sink and elastically deformable in relation to the heat sink, and a cooling fan located at the end portion of the heat pipe.
Public/Granted literature
- US20090141450A1 HEAT DISSIPATING STRUCTURE FOR ELECTRONIC COMPONENT AND DISPLAY DEVICE Public/Granted day:2009-06-04
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