Invention Grant
US07898807B2 Methods for making millichannel substrate, and cooling device and apparatus using the substrate
有权
制造毫通底材的方法以及使用该基材的冷却装置和装置
- Patent Title: Methods for making millichannel substrate, and cooling device and apparatus using the substrate
- Patent Title (中): 制造毫通底材的方法以及使用该基材的冷却装置和装置
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Application No.: US12400067Application Date: 2009-03-09
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Publication No.: US07898807B2Publication Date: 2011-03-01
- Inventor: Richard Alfred Beaupre , Ljubisa Dragoljub Stevanovic
- Applicant: Richard Alfred Beaupre , Ljubisa Dragoljub Stevanovic
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Scott J. Asmus
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of the middle ceramic layer. The lower metal layer has a plurality of millichannels configured to deliver a coolant for cooling the power electronics, wherein the millichannels are formed on the lower metal layer prior to attachment to the lower surface of the middle ceramic layer. Methods for making a cooling device and an apparatus are also presented.
Public/Granted literature
- US20100226093A1 METHODS FOR MAKING MILLICHANNEL SUBSTRATE, AND COOLING DEVICE AND APPARATUS USING THE SUBSTRATE Public/Granted day:2010-09-09
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