A light emitting diode (LED) lighting assembly includes a printed circuit board that includes a dielectric layer sandwiched between first conductive layers. The printed circuit board includes vias extending there through, with thermally conductive plugs in the vias. A second conductive layer is on each first conductive layer and on the thermally conductive plugs. The thermally conductive plugs are enclosed by the second conductive layers. LEDs are coupled to the printed circuit board, with each LED being mounted over at least one thermally conductive plug to dissipate heat therefrom.