Invention Grant
US07898813B2 Semiconductor memory device and semiconductor memory card using the same
有权
半导体存储器件和使用其的半导体存储卡
- Patent Title: Semiconductor memory device and semiconductor memory card using the same
- Patent Title (中): 半导体存储器件和使用其的半导体存储卡
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Application No.: US11767801Application Date: 2007-06-25
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Publication No.: US07898813B2Publication Date: 2011-03-01
- Inventor: Taku Nishiyama , Kiyokazu Okada , Yoriyasu Ando , Tetsuya Yamamoto , Naohisa Okumura
- Applicant: Taku Nishiyama , Kiyokazu Okada , Yoriyasu Ando , Tetsuya Yamamoto , Naohisa Okumura
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/14
- IPC: H05K1/14
Abstract:
A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a thickness greater than that of the semiconductor memory element of an upper side. The semiconductor memory elements are electrically connected to the connection pads of the wiring board via metal wires.
Public/Granted literature
- US20080316696A1 SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY CARD USING THE SAME Public/Granted day:2008-12-25
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