Invention Grant
US07898834B2 Semiconductor chip with chip selection structure and stacked semiconductor package having the same
有权
具有芯片选择结构的半导体芯片和具有相同的堆叠半导体封装
- Patent Title: Semiconductor chip with chip selection structure and stacked semiconductor package having the same
- Patent Title (中): 具有芯片选择结构的半导体芯片和具有相同的堆叠半导体封装
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Application No.: US12059308Application Date: 2008-03-31
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Publication No.: US07898834B2Publication Date: 2011-03-01
- Inventor: Sung Min Kim , Chang Jun Park , Kwon Whan Han , Seong Cheol Kim , Ha Na Lee
- Applicant: Sung Min Kim , Chang Jun Park , Kwon Whan Han , Seong Cheol Kim , Ha Na Lee
- Applicant Address: KR Kyoungki-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Kyoungki-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2008-0008252 20080125
- Main IPC: G11C5/02
- IPC: G11C5/02
Abstract:
A semiconductor chip with a chip selection structure suitable for a stacked semiconductor chip includes a semiconductor chip body and a chip selection structure. The chip selection structure includes a chip selection pad disposed over the semiconductor chip body, a main through electrode electrically connected to the chip selection pad, and a sub through electrode interposed between the main through electrode and the chip selection pad. A plurality of the semiconductor chips, each having the same chip selection structure, can be stacked by offsetting the stacked semiconductor chips.
Public/Granted literature
- US20090189267A1 SEMICONDUCTOR CHIP WITH CHIP SELECTION STRUCTURE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME Public/Granted day:2009-07-30
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