Invention Grant
- Patent Title: Memory module
- Patent Title (中): 内存模块
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Application No.: US12351005Application Date: 2009-01-09
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Publication No.: US07898858B2Publication Date: 2011-03-01
- Inventor: Takashi Abe
- Applicant: Takashi Abe
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2008-020976 20080131
- Main IPC: G11C11/34
- IPC: G11C11/34
Abstract:
The present invention provides a reliable memory module. The memory module including a plurality of memory devices arranged on a circuit board and controlled by an external memory controller includes a buffer having a function of detecting and correcting an error and a nonvolatile storage area that stores contents of the error.
Public/Granted literature
- US20090196101A1 MEMORY MODULE Public/Granted day:2009-08-06
Information query
