Invention Grant
- Patent Title: Layer 2/layer 3 interworking via internal virtual UNI
- Patent Title (中): 第2层/第3层通过内部虚拟UNI互通
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Application No.: US12246925Application Date: 2008-10-07
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Publication No.: US07899062B2Publication Date: 2011-03-01
- Inventor: Kuo-Hui Liu , Shih-Chung Soon
- Applicant: Kuo-Hui Liu , Shih-Chung Soon
- Applicant Address: US NV Reno
- Assignee: AT&T Intellectual Property I, L.P.
- Current Assignee: AT&T Intellectual Property I, L.P.
- Current Assignee Address: US NV Reno
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: H04L12/56
- IPC: H04L12/56

Abstract:
A multi service platform having multiple layer switching includes a layer two switching component disposed within an enclosure of the multi service platform. A layer three switching component is disposed within and integrated together with the layer two switching component within the enclosure of the multi service platform. A connection, including an internal virtual UNI connection, terminates at the layer two switching component and at the layer three switching component. The connection is disposed internally within the multi service platform.
Public/Granted literature
- US20090041027A1 LAYER 2/LAYER 3 INTERWORKING VIA INTERNAL VIRTUAL UNI Public/Granted day:2009-02-12
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