Invention Grant
US07899102B2 Semiconductor laser, method for manufacturing semiconductor laser, optical disk device, and optical pickup
有权
半导体激光器,半导体激光器的制造方法,光盘装置和光学拾取器
- Patent Title: Semiconductor laser, method for manufacturing semiconductor laser, optical disk device, and optical pickup
- Patent Title (中): 半导体激光器,半导体激光器的制造方法,光盘装置和光学拾取器
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Application No.: US12487195Application Date: 2009-06-18
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Publication No.: US07899102B2Publication Date: 2011-03-01
- Inventor: Toshiaki Obata
- Applicant: Toshiaki Obata
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2008-161523 20080620
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A semiconductor laser including: a nitride III-V compound semiconductor substrate configured to have a first planar area, a second planar area, and a third planar area in a major surface, the first planar area being formed of a C-plane, the second planar area being continuous with the first planar area and being formed of a semipolar plane inclined to the first planar area, the third planar area being continuous with the second planar area and being formed of a C-plane parallel to the first planar area; a first cladding layer configured to be composed of a nitride III-V compound semiconductor on the major surface of the nitride III-V compound semiconductor substrate; an active layer configured to be composed of a nitride III-V compound semiconductor that exists on the first cladding layer and contains In; and a second cladding layer configured to be composed of a nitride III-V compound semiconductor on the active layer.
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