In order to solve the problem of determining a barrier layer temperature in a semiconductor communication component (1) and thus to guarantee normal operation of the same, for example in a communication system (10) in the form of an xDSL connection card, according to the present invention temperature sensing means (20) for gauging the barrier layer temperature of a circuit arrangement on the communication semiconductor component (1) are integrated in the same. In accordance with the invention the communication system (10) comprises at least one communication semiconductor component (1) according to the invention and a control unit (12), that utilizes the values of the barrier layer temperature made available by the temperature sensing means, which are integrated in the communication semiconductor component (1), and this can be used for regulating cooling devices (18, 19) or for switching the communication semiconductor component (1) to an energy saving mode for example.