Invention Grant
- Patent Title: High frequency signal combining
- Patent Title (中): 高频信号组合
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Application No.: US11742734Application Date: 2007-05-01
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Publication No.: US07899407B2Publication Date: 2011-03-01
- Inventor: Ahmadreza (Reza) Rofougaran
- Applicant: Ahmadreza (Reza) Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick Harrison & Markison
- Agent Bruce E. Stuckman
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H04B7/00 ; H04B1/08 ; H04M1/00

Abstract:
A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers.
Public/Granted literature
- US20080274712A1 HIGH FREQUENCY SIGNAL COMBINING Public/Granted day:2008-11-06
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