Invention Grant
- Patent Title: Methods and apparatus for supporting multiple connections
- Patent Title (中): 支持多个连接的方法和装置
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Application No.: US11486824Application Date: 2006-07-14
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Publication No.: US07899495B2Publication Date: 2011-03-01
- Inventor: Rajiv Laroia , Das Arnab , Murari Srinivasan , Pablo Anigstein , Vladimir Parizhsky , M. Scott Corson
- Applicant: Rajiv Laroia , Das Arnab , Murari Srinivasan , Pablo Anigstein , Vladimir Parizhsky , M. Scott Corson
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Agent Milan I. Patel; Jonathan T. Velasco
- Main IPC: H04B1/38
- IPC: H04B1/38

Abstract:
Systems and methodologies are described that facilitate supporting multiple connections associated with a wireless terminal. Notifications may be provided to a primary base station upon establishment and/or removal of connections between the wireless terminal and secondary base station(s). Additionally, the multiple connections may be evaluated and a preferred connection from the set of multiple connections may be utilized to transfer data to the wireless terminal over a downlink connection.
Public/Granted literature
- US20080014991A1 Methods and apparatus for supporting multiple connections Public/Granted day:2008-01-17
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