Invention Grant
- Patent Title: Apparatus and method for packaging a capacitor
- Patent Title (中): 用于封装电容器的装置和方法
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Application No.: US10574343Application Date: 2004-09-21
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Publication No.: US07899529B2Publication Date: 2011-03-01
- Inventor: Daniel J. Powers
- Applicant: Daniel J. Powers
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee Address: NL Eindhoven
- Agent W. Brinton Yorks, Jr.
- International Application: PCT/IB2004/051812 WO 20040921
- International Announcement: WO2005/034154 WO 20050414
- Main IPC: A61N1/39
- IPC: A61N1/39
Abstract:
An electronic device includes a housing (20) having a first interior region (26) and a second interior region (28). The second interior region (28) is sized to receive an electronic interface (18). The device also includes a wound capacitor core (14) adapted for electrical communication with the second interior region (28), and a capacitor potting material (38) disposed in contact with the first interior region (26) and the wound capacitor core (14).
Public/Granted literature
- US20070010134A1 Apparatus and method for packaging a capacitor Public/Granted day:2007-01-11
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