Invention Grant
- Patent Title: Cardiac lead implantation system
- Patent Title (中): 心脏铅植入系统
-
Application No.: US12070079Application Date: 2008-02-15
-
Publication No.: US07899549B2Publication Date: 2011-03-01
- Inventor: Robert J. Sweeney , Ed J. Mikolajczyk
- Applicant: Robert J. Sweeney , Ed J. Mikolajczyk
- Applicant Address: US MN St. Paul
- Assignee: Cardiac Pacemakers, Inc.
- Current Assignee: Cardiac Pacemakers, Inc.
- Current Assignee Address: US MN St. Paul
- Agency: Hollingsworth & Funk, LLC
- Main IPC: A61N1/05
- IPC: A61N1/05

Abstract:
Cardiac lead implantation systems and methods including an electronics arrangement provided with a user interface and a coupler assembly. A coupler body is configured to detachably grasp a cardiac lead and couple with electrical contacts of the cardiac lead. A user interface includes an output indicative of sensed cardiac parameters, such as one or both of cardiac signal amplitude and lead electrode impedance, and may include an audio output device and/or a visual output device. Methods of lead implantation involve advancing a cardiac lead into proximity with a patient's heart, and contacting cardiac tissue with an electrode arrangement to locate a suitable implant location. Sensing of one or more cardiac parameters is accomplished and an audible representation of the sensed parameters is produced, the audible representation varying as the electrode arrangement is moved relative to the cardiac tissue.
Public/Granted literature
- US20080147157A1 Cardiac lead implantation system Public/Granted day:2008-06-19
Information query