Invention Grant
- Patent Title: Semiconductor integrated circuit device
- Patent Title (中): 半导体集成电路器件
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Application No.: US11935790Application Date: 2007-11-06
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Publication No.: US07899643B2Publication Date: 2011-03-01
- Inventor: Makoto Saen , Kenichi Osada , Tetsuya Yamada , Yusuke Kanno , Satoshi Misaka
- Applicant: Makoto Saen , Kenichi Osada , Tetsuya Yamada , Yusuke Kanno , Satoshi Misaka
- Applicant Address: JP Kawasaki-shi
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Miles & Stockbridge P.C.
- Priority: JP2006-303873 20061109
- Main IPC: G01K1/12
- IPC: G01K1/12 ; G06F19/00

Abstract:
A semiconductor integrated circuit device which consumes less power and enables real-time processing. The semiconductor integrated circuit device includes thermal sensors which detect temperature and determine whether the detection result exceeds reference values and output the result, and a control block capable of controlling the operations of arithmetic blocks based on the output signals of the thermal sensors. The control block returns to an operation state from a suspended state with an interrupt signal based on the output signals of the thermal sensors and determines the operation conditions of the arithmetic blocks to ensure that the temperature conditions of the arithmetic blocks are satisfied. Thereby, power consumption is reduced and real-time processing efficiency is improved.
Public/Granted literature
- US20080114967A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE Public/Granted day:2008-05-15
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