Invention Grant
- Patent Title: Semiconductor chip using specification interface
- Patent Title (中): 半导体芯片采用规格接口
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Application No.: US11898241Application Date: 2007-09-11
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Publication No.: US07900180B2Publication Date: 2011-03-01
- Inventor: Mutsuhiro Ohmori
- Applicant: Mutsuhiro Ohmori
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2006-290090 20061025
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
Disclosed herein is a semiconductor chip including at least two processing apparatuses which comply with the same interface specifications and which differ in internal structure, wherein at least one of the processing apparatuses is constituted functionally to replace at least one processing apparatus.
Public/Granted literature
- US20080104366A1 Semiconductor chip Public/Granted day:2008-05-01
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