Invention Grant
- Patent Title: Method for manufacturing fluid ejecting head and method for manufacturing fluid ejecting apparatus
- Patent Title (中): 制造流体喷射头的方法和制造流体喷射装置的方法
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Application No.: US12209475Application Date: 2008-09-12
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Publication No.: US07900328B2Publication Date: 2011-03-08
- Inventor: Hitoshi Suzawa , Toshikazu Niki , Takateru Yamashita
- Applicant: Hitoshi Suzawa , Toshikazu Niki , Takateru Yamashita
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2007-239444 20070914
- Main IPC: H01L41/00
- IPC: H01L41/00 ; H04R17/00 ; B23P17/00 ; B21D53/76 ; B41J2/15 ; B41J2/145 ; B41J2/135

Abstract:
A method for manufacturing a fluid ejecting head includes providing a channel unit including a vibrating plate having nozzle openings through which fluid is ejected and a pressure chamber that communicates with the nozzle openings. A piezoelectric unit includes a piezoelectric element that vibrates the vibrating plate of the channel unit and which includes a securing plate which secures the piezoelectric element. A head case having a housing chamber houses the piezoelectric unit which is pressed against the vibrating plate in a housing direction such that a portion of the piezoelectric unit is also pressed against a sidewall of the housing chamber. The piezoelectric element is secured directly the vibrating plate and the securing plate is secured directly to head case using a bonding process which is performed while the piezoelectric unit is being pressed against the vibrating plate and the sidewall.
Public/Granted literature
- US20090071004A1 METHOD FOR MANUFACTURING FLUID EJECTING HEAD AND METHOD FOR MANUFACTURING FLUID EJECTING APPARATUS Public/Granted day:2009-03-19
Information query
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