Invention Grant
- Patent Title: Work assembling device and assembling method
- Patent Title (中): 工作组装装置及装配方法
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Application No.: US10597686Application Date: 2004-11-02
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Publication No.: US07900331B2Publication Date: 2011-03-08
- Inventor: Takashi Yoshida , Muneki Yamada , Tetsuo Ishii , Takaji Mukumoto
- Applicant: Takashi Yoshida , Muneki Yamada , Tetsuo Ishii , Takaji Mukumoto
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Ranklin, Hill & Clark LLP
- Priority: JP2004-026212 20040203; JP2004-026213 20040203; JP2004-026214 20040203
- International Application: PCT/JP2004/016251 WO 20041102
- International Announcement: WO2005/075144 WO 20050818
- Main IPC: B23Q7/00
- IPC: B23Q7/00 ; G01M19/00
Abstract:
A work (W) with a part assembling surface on many faces is rotated by a work holding jig (10) so as to sequentially convert each of the part assembling surfaces to the upward horizontal attitude, a bolt is fastened from above vertically while gripping an assembly part (B) by a part gripping device (12), and this is repeated so that an assembling operation can be carried out smoothly and an assembly space can be saved.
Public/Granted literature
- US20070169331A1 Work assembling device and assembling method Public/Granted day:2007-07-26
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