Invention Grant
- Patent Title: Closed forging die and forging method
- Patent Title (中): 封闭锻造和锻造方法
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Application No.: US12007099Application Date: 2008-01-07
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Publication No.: US07900493B2Publication Date: 2011-03-08
- Inventor: Miao Jiahua , Akira Sera , Nobuo Suzuki
- Applicant: Miao Jiahua , Akira Sera , Nobuo Suzuki
- Applicant Address: JP Osaka-fu
- Assignee: NTN Corporation
- Current Assignee: NTN Corporation
- Current Assignee Address: JP Osaka-fu
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-024346 20070202
- Main IPC: B21D22/00
- IPC: B21D22/00

Abstract:
A closed forging die and a forging method with which sagging can be reduced, a constant velocity joint and a universal joint can be made compact and lightweight, removal of a shaft tip thereof by machining prior to heat treatment is not required, and material costs and machining costs can be reduced by using a closed forging die includes openable dies, and punches that move in an opening/closing direction of the dies to pressurize a material in the dies. By using the die, a product having shaft portions formed radially is manufactured. A clearance is provided to each of the formed shaft portions between a tip surface, and abutting portions are provided to the dies side abutting against at least a tip side of an outer circumferential surface of the shaft portions.
Public/Granted literature
- US20080184765A1 Closed forging die and forging method Public/Granted day:2008-08-07
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