Invention Grant
- Patent Title: Exposed pad backside pressure sensor package
- Patent Title (中): 暴露垫背面压力传感器封装
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Application No.: US12368402Application Date: 2009-02-10
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Publication No.: US07900521B2Publication Date: 2011-03-08
- Inventor: Stephen R. Hooper , James D. MacDonald , William G. McDonald
- Applicant: Stephen R. Hooper , James D. MacDonald , William G. McDonald
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Hamilton & Terrile, LLP
- Agent Michael Rocco Cannatti
- Main IPC: G01L7/00
- IPC: G01L7/00
Abstract:
A method and apparatus are described for fabricating an exposed backside pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a pressure sensor transducer die (31) from corrosive particles using a protective gel layer (38) and molding compound (39), but which vents a piezoresistive transducer sensor diaphragm (33) formed on a backside of the pressure sensor transducer die (31) through a vent hole (42) formed in an exposed die flag (36), enabling the sensor diaphragm (33) to directly sense pressure variations without the influence of a protective gel.
Public/Granted literature
- US20100199777A1 Exposed Pad Backside Pressure Sensor Package Public/Granted day:2010-08-12
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