Invention Grant
US07900579B2 Heat treatment method wherein the substrate holder is composed of two holder constituting bodies that move relative to each other
有权
热处理方法,其中基板保持件由相对于彼此移动的两个保持器构成体构成
- Patent Title: Heat treatment method wherein the substrate holder is composed of two holder constituting bodies that move relative to each other
- Patent Title (中): 热处理方法,其中基板保持件由相对于彼此移动的两个保持器构成体构成
-
Application No.: US12232751Application Date: 2008-09-23
-
Publication No.: US07900579B2Publication Date: 2011-03-08
- Inventor: Hisashi Inoue , Shunichi Matsumoto , Yasushi Takeuchi
- Applicant: Hisashi Inoue , Shunichi Matsumoto , Yasushi Takeuchi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2007-249039 20070926; JP2007-249040 20070926
- Main IPC: C23C16/00
- IPC: C23C16/00 ; H01L21/00 ; F27D3/12

Abstract:
A heat treatment method includes a substrate holder that holds a plurality of substrates at predetermined vertical intervals and is carried into a heat treating furnace for performing a predetermined heat treatment on the substrates. The substrate holder has two holder constituting bodies each having a plurality of columns and substrate holding sections. One of the holder constituting bodies holds the substrates at a first, vertically adjacent distance so that their front surfaces face each other, while the other of the holder constituting bodies holds the substrates at a second, vertically adjacent distance so that their back surfaces face each other wherein the second distance is smaller than the first distance to ensure uniformity of the heat treatment. At least one of the holder constituting bodies moves in the vertical direction to change the positions of the holder constituting bodies relative to each other.
Public/Granted literature
- US20090081887A1 Heat treatment method and heat treatment apparatus Public/Granted day:2009-03-26
Information query
IPC分类: