Invention Grant
- Patent Title: Sheet sticking apparatus
- Patent Title (中): 贴纸装置
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Application No.: US11916788Application Date: 2006-06-26
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Publication No.: US07900677B2Publication Date: 2011-03-08
- Inventor: Hideaki Nonaka , Kenji Kobayashi
- Applicant: Hideaki Nonaka , Kenji Kobayashi
- Applicant Address: JP Tokyo
- Assignee: Lintec Corporation
- Current Assignee: Lintec Corporation
- Current Assignee Address: JP Tokyo
- Agency: Lowe Hauptman Ham & Berner LLP
- Priority: JP2005-198807 20050707
- International Application: PCT/JP2006/312686 WO 20060626
- International Announcement: WO2007/007532 WO 20070118
- Main IPC: H01L21/683
- IPC: H01L21/683

Abstract:
A sheet sticking apparatus comprises a sheet feed-out unit 12 including a peel plate 22 for peeling off an adhesive sheet S from a release liner PS; and a press roller 14 for pressing the adhesive sheet S onto a wafer W supported by a table 13 to stick the sheet thereto, wherein the peel plate 22 is supported movably forward and backward by a cylinder 50. The peel plate 22 is arranged so that the initial position of the front end is adjusted forward/backward corresponding to the size of the wafer W or the size of the table 13 supporting the same.
Public/Granted literature
- US20090223638A1 SHEET STICKING APPARATUS Public/Granted day:2009-09-10
Information query
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