Invention Grant
- Patent Title: Bumper panel assembly
- Patent Title (中): 保险杠面板组装
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Application No.: US12355162Application Date: 2009-01-16
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Publication No.: US07900982B2Publication Date: 2011-03-08
- Inventor: Jaime Nicole Moore
- Applicant: Jaime Nicole Moore
- Applicant Address: US KY Erlanger
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee Address: US KY Erlanger
- Agency: Gifford, Krass, Sprinkle, Anderson & Citkowski, P.C.
- Main IPC: B60R19/03
- IPC: B60R19/03

Abstract:
A bumper panel assembly for use in a vehicle including an upper bumper panel and a lower bumper panel attached to the upper bumper panel. The bumper panel assembly is formed without cut outs and walls so as to eliminate the need of using lifters to form the bumper panel assembly, and thus reducing manufacturing costs. The upper bumper panel includes a groove extending along the width of the panel, and the lower bumper has a first edge seated along the groove so as to define a styling line. The lower panel further includes a second edge spaced apart from the first edge. A seal is disposed on the second edge and interconnects the lower bumper panel to the vehicle body when the vehicle bumper is assembled onto the vehicle so as to enhance the aerodynamic characteristics of the bumper panel assembly.
Public/Granted literature
- US20100181785A1 BUMPER PANEL ASSEMBLY Public/Granted day:2010-07-22
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