Invention Grant
- Patent Title: Print head unit and method for manufacturing patterned layer on substrate with the same
- Patent Title (中): 印刷头单元及其制造方法
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Application No.: US11938463Application Date: 2007-11-12
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Publication No.: US07901036B2Publication Date: 2011-03-08
- Inventor: Chinchung John Won
- Applicant: Chinchung John Won
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Jeffrey T. Knapp
- Main IPC: B41J2/25
- IPC: B41J2/25

Abstract:
A print head unit (10) for manufacturing a patterned layer on a substrate is provided. The print head unit includes a first print head (12a), a second print head (12b), a third print head (12c), and a print head frame (11). The print head unit further includes parallelism adjusting means and position adjusting means. The parallelism adjusting means configured for rotationally moving at least one of the first print head and the third print head relative to the second print head so as to adjust parallelism between the first nozzle line, the second nozzle line, and the third nozzle line. The position adjusting means is configured for linearly moving at least one of the first print head and the third print head in the nozzle line direction.
Public/Granted literature
- US20090122095A1 PRINT HEAD UNIT AND METHOD FOR MANUFACTURING PATTERNED LAYER ON SUBSTRATE WITH THE SAME Public/Granted day:2009-05-14
Information query
IPC分类: