Invention Grant
- Patent Title: Printhead assembly incorporating heat aligning printhead modules
- Patent Title (中): 包含热定位打印头模块的打印头组件
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Application No.: US12859235Application Date: 2010-08-18
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Publication No.: US07901038B2Publication Date: 2011-03-08
- Inventor: Kia Silverbrook
- Applicant: Kia Silverbrook
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: B41J2/155
- IPC: B41J2/155 ; B41J2/14 ; B41J2/16

Abstract:
A printhead assembly for a printer comprises a support member having a silicon core mounted within a metal channel; a plurality of printhead modules mounted on the support member, each printhead module including an integrated circuit manufactured using micro-electromechanical Systems (MEMS) techniques; and an elastomeric layer positioned between the core and the metal channel. The printhead modules and support members are configured to move into alignment with each other upon heating of the printhead assembly, and each printhead module is mounted to the silicon core with a neck portion.
Public/Granted literature
- US20100309254A1 PRINTHEAD ASSEMBLY INCORPORATING HEAT ALIGNING PRINTHEAD MODULES Public/Granted day:2010-12-09
Information query
IPC分类: