A thermal bend actuator is provided. The bend actuator comprises (i) a first active cantilever beam for connection to drive circuitry, the first beam comprising a planar beam element having a bend; (ii) a second passive cantilever beam mechanically cooperating with the first beam, such that when a current is passed through the first beam, the first beam expands relative to the second beam, resulting in bending of the actuator; and (iii) a conduction pad positioned at a bend region of the beam element. The conduction pad is configured to facilitate electrical conduction in the bend region.