Invention Grant
- Patent Title: Thermal inkjet printhead on a metallic substrate
- Patent Title (中): 热喷墨打印头在金属基板上
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Application No.: US12100565Application Date: 2008-04-10
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Publication No.: US07901057B2Publication Date: 2011-03-08
- Inventor: Stanley W. Stephenson, III
- Applicant: Stanley W. Stephenson, III
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent William R. Zimmerli
- Main IPC: B41J2/05
- IPC: B41J2/05 ; G11B5/127

Abstract:
A printhead and method of forming the printhead are provided. The method includes forming an ink feed passage through a print head substrate by providing a metallic substrate having a first surface and a second surface; providing an ink ejector structure on a first surface of the metallic substrate; providing a mask over the second surface of the metallic substrate to define the ink feed passage; and forming the ink feed passage from the second surface of the metallic substrate using a liquid etchant.
Public/Granted literature
- US20090258236A1 THERMAL INKJET PRINTHEAD ON A METALLIC SUBSTRATE Public/Granted day:2009-10-15
Information query
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