Invention Grant
- Patent Title: Optical interconnect solution
- Patent Title (中): 光互连解决方案
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Application No.: US12049062Application Date: 2008-03-14
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Publication No.: US07901144B2Publication Date: 2011-03-08
- Inventor: Hongyu Deng
- Applicant: Hongyu Deng
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Wyatt, Tarrant & Combs, LLP
- Agent William S. Parks
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
A low-cost, high-speed optical interconnect replacement for current electrical interconnects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. A bare optical fiber is then used to transmit the signal from an optical encoding source to an optical receiver, providing a high-speed method of replacement for traditional electrical interconnects.
Public/Granted literature
- US20090232514A1 Optical Interconnect Solution Public/Granted day:2009-09-17
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