Invention Grant
- Patent Title: Mini optical subassembly
- Patent Title (中): 迷你光学组件
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Application No.: US12049123Application Date: 2008-03-14
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Publication No.: US07901145B2Publication Date: 2011-03-08
- Inventor: Hongyu Deng , Maziar Amirkiai
- Applicant: Hongyu Deng , Maziar Amirkiai
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Wyatt, Tarrant & Combs, LLP
- Agent William S. Parks
- Main IPC: G02B6/36
- IPC: G02B6/36

Abstract:
A low-cost, high-speed micro-connector replacement for current electrical inter-connects and intra-connects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. The micro-connector is mounted on a PCB in alignment with the transmitting or receiving modules and provides appropriate alignment and stop positioning of an optical fiber used for optical transmitting between transmitting/receiving modules.
Public/Granted literature
- US20090232456A1 Mini Optical Subassembly Public/Granted day:2009-09-17
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