Invention Grant
- Patent Title: Molding apparatus
- Patent Title (中): 成型设备
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Application No.: US11655080Application Date: 2007-01-19
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Publication No.: US07901200B2Publication Date: 2011-03-08
- Inventor: Takashi Satoh , Sadaki Satoh , Ken Kikuchi , Masashi Gotoh , Takeshi Itoh , Takuo Kataho
- Applicant: Takashi Satoh , Sadaki Satoh , Ken Kikuchi , Masashi Gotoh , Takeshi Itoh , Takuo Kataho
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-098298 20060331; JP2006-218806 20060810
- Main IPC: B29C43/04
- IPC: B29C43/04

Abstract:
A lower punch is arranged to be inserted into a cavity of a die from a lower side of the die. A upper punch is arranged to be inserted into the cavity from an upper side of the die to compact the powder filled in the cavity, in cooperation with the lower punch. A feeder supplies the powder into the cavity. A first cam driving system has a first cam for vertically moving the die relative to the lower punch. A second cam driving system has a second cam for vertically moving the upper punch. A third cam driving system has a third cam for moving the feeder forward or backward relative to the cavity. A contact member is connected to the first cam driving system. A stopper is located above or below the contact member and regulates relative vertical movement of the die with respect to the lower punch, in cooperation with the contact member. A fourth cam driving system has a fourth cam for vertically moving the stopper. The first cam, the second cam, the third cam, and the fourth cam are rotated in synchronism.
Public/Granted literature
- US20070231420A1 Molding apparatus Public/Granted day:2007-10-04
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