Invention Grant
- Patent Title: Electronics module for an installation module
- Patent Title (中): 用于安装模块的电子模块
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Application No.: US12633250Application Date: 2009-12-08
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Publication No.: US07901223B2Publication Date: 2011-03-08
- Inventor: Michael Bräunlich , Daniela Rochlitzer , Thomas Ott
- Applicant: Michael Bräunlich , Daniela Rochlitzer , Thomas Ott
- Applicant Address: DE München
- Assignee: Siemens AG
- Current Assignee: Siemens AG
- Current Assignee Address: DE München
- Agency: Cohen Pontani Lieberman & Pavane LLP
- Priority: EP08021383 20081209
- Main IPC: H01R13/44
- IPC: H01R13/44

Abstract:
An electronics module configured to be plugged into an installation module having an isolating element which is operated by an operating means to close and open a circuit during an insertion process and withdrawal process, respectively, wherein the isolating element includes a first connection having a first contact area, a second connection having a second contact area, and a closing element having a third contact area and a fourth contact area. The closing element is arranged in a disconnected position such that a first isolation separation is provided between the first contact area and the third contact area, and a second isolation separation is provided between the second contact area and the fourth contact area.
Public/Granted literature
- US20100144178A1 Electronics Module for an Installation Module Public/Granted day:2010-06-10
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