Invention Grant
- Patent Title: Telecommunication patch panel
- Patent Title (中): 电讯接线板
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Application No.: US12130183Application Date: 2008-05-30
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Publication No.: US07901236B2Publication Date: 2011-03-08
- Inventor: Leonard James Patchett
- Applicant: Leonard James Patchett
- Applicant Address: DE Berlin
- Assignee: ADC GmbH
- Current Assignee: ADC GmbH
- Current Assignee Address: DE Berlin
- Agency: Merchant & Gould P.C.
- Priority: AU2007904848 20070906
- Main IPC: H01R13/627
- IPC: H01R13/627

Abstract:
A telecommunications patch panel, including a frame member including a plurality of connector module mounts; and a plurality of connector modules, each being coupled to one of said mounts in one of a plurality of positions about an axis of rotation, wherein a first side of each connector module of said modules includes a plurality first of connector jacks in electrical communication with a second connector jack coupled to an opposite facing second side of the module.
Public/Granted literature
- US20090068881A1 TELECOMMUNICATION PATCH PANEL Public/Granted day:2009-03-12
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