Invention Grant
- Patent Title: Polishing composition and polishing method
- Patent Title (中): 抛光组合物和抛光方法
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Application No.: US11793347Application Date: 2005-12-22
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Publication No.: US07901474B2Publication Date: 2011-03-08
- Inventor: Ayako Nishioka , Yuji Itoh , Yoshitomo Shimazu
- Applicant: Ayako Nishioka , Yuji Itoh , Yoshitomo Shimazu
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-372101 20041222
- International Application: PCT/JP2005/024190 WO 20051222
- International Announcement: WO2006/068328 WO 20060629
- Main IPC: B24D3/02
- IPC: B24D3/02 ; C09C1/68 ; C09K3/14 ; H01L21/302
Abstract:
The present invention provide a chemical-mechanical polishing composition for inhibiting dishing and erosion as well as rapidly polishing an insulating film and barrier film at the same time while maintaining the flatness of the substrate surface polished. The present chemical-mechanical polishing composition comprises methanesulfonic acid, an alkali metal ion, an oxidizing agent, a silica abrasive and water, and has a pH of 8 to 12.
Public/Granted literature
- US20080138990A1 Polishing Composition and Polishing Method Public/Granted day:2008-06-12
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