Invention Grant
- Patent Title: Reducing introduction of foreign material to wafers
- Patent Title (中): 减少异物引入硅片
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Application No.: US11972118Application Date: 2008-01-10
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Publication No.: US07901490B2Publication Date: 2011-03-08
- Inventor: David J. Clark , Alison K. Easton , James E. Fluegel , James H. Peterman
- Applicant: David J. Clark , Alison K. Easton , James E. Fluegel , James H. Peterman
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Ian Mackinnon
- Main IPC: C23C16/00
- IPC: C23C16/00
Abstract:
A system and method of reducing the introduction of foreign material to wafers. A system includes an enclosure structured and arranged to carry wafers used in semiconductor device manufacturing, and an attractive material arranged as at least a portion of an interior surface of the enclosure.
Public/Granted literature
- US20090180848A1 REDUCING INTRODUCTION OF FOREIGN MATERIAL TO WAFERS Public/Granted day:2009-07-16
Information query
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