Invention Grant
- Patent Title: Method and arrangement for impregnating chips
- Patent Title (中): 浸渍芯片的方法和布置
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Application No.: US11572106Application Date: 2005-07-14
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Publication No.: US07901541B2Publication Date: 2011-03-08
- Inventor: Vidar Snekkenes , Lennart Gustavsson , Daniel Trolin , Mats Nasman
- Applicant: Vidar Snekkenes , Lennart Gustavsson , Daniel Trolin , Mats Nasman
- Applicant Address: SE Karlstad
- Assignee: Metso Fiber Karlstad AB
- Current Assignee: Metso Fiber Karlstad AB
- Current Assignee Address: SE Karlstad
- Agency: Fasth Law Offices
- Agent Rolf Fasth
- Priority: SE0401870 20040715
- International Application: PCT/SE2005/001162 WO 20050714
- International Announcement: WO2006/006934 WO 20060119
- Main IPC: D21C1/00
- IPC: D21C1/00

Abstract:
The method is for the impregnation of chips during the manufacture of chemical pulp. The chips are continuously fed without preceding steam treatment to the top of an impregnation vessel that maintains atmospheric pressure. Impregnation fluid (BL) is added to the impregnation vessel and establishes a fluid level (LIQ_LEV). The chips that have been added establish a chips level (CH_LEV) that lies at least 3-5 meters over the fluid level. The temperature at the top of the vessel essentially corresponds to ambient temperature.Impregnation fluid BL is fed in to the impregnation vessel in such an amount and at such a temperature that the temperature that is established at the fluid level (LIQ_LEV) is established within the interval 90-115° C., preferably within the interval 95-105° C.
Public/Granted literature
- US20080093041A1 Method and Arrangement for Impregnating Chips Public/Granted day:2008-04-24
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