Invention Grant
- Patent Title: Injection molding flow control apparatus and method
- Patent Title (中): 注塑流量控制装置及方法
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Application No.: US12239914Application Date: 2008-09-29
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Publication No.: US07901601B2Publication Date: 2011-03-08
- Inventor: Michael Vasapoli , Sergio Antunes , Mark Moss , Christopher W. Lee , Mark Doyle
- Applicant: Michael Vasapoli , Sergio Antunes , Mark Moss , Christopher W. Lee , Mark Doyle
- Applicant Address: US MA Peabody
- Assignee: Synventive Molding Solutions, Inc.
- Current Assignee: Synventive Molding Solutions, Inc.
- Current Assignee Address: US MA Peabody
- Agency: Rissman Hendricks & Oliverio, LLP
- Main IPC: B29C45/76
- IPC: B29C45/76

Abstract:
Apparatus for controlling the rate of flow of fluid material through an injection molding flow channel leading to a mold cavity, the apparatus comprising: a pin having a longitudinal length being adapted for back and forth axial movement through the flow channel; the pin having a protrusion at a selected position along its length, the protrusion having an upstream end and a downstream end and a maximum diameter circumferential surface intermediate the upstream and downstream ends; the channel having an interior surface area portion which is complementary to the maximum diameter circumferential surface of the protrusion of the pin; and the pin being slidable to a position within the channel such that the maximum diameter circumferential surface of the protrusion forms a seal with the complementary interior surface portion of the channel to stop flow of the fluid material.
Public/Granted literature
- US20090028986A1 INJECTION MOLDING FLOW CONTROL APPARATUS AND METHOD Public/Granted day:2009-01-29
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