Invention Grant
US07901607B2 Method of low temperature imprinting process with high pattern transfer yield 有权
低温压印方法,具有高图案转印率

Method of low temperature imprinting process with high pattern transfer yield
Abstract:
The present invention is directed to novel methods of imprinting substrate-supported or freestanding structures at low cost, with high pattern transfer yield, and using low processing temperature. Such methods overcome many of the above-described limitations of the prior art. Generally, such methods of the present invention employ a sacrificial layer of film.
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