The invention relates to electronic devices whose electronic properties can surprisingly be improved to a significant degree by inserting at least one crosslinkable polymeric buffer layer, preferably a cationically crosslinkable polymeric buffer layer, between the conductive doped polymer and the organic semiconductor layer. Particularly good properties are obtained with a buffer layer in which crosslinking is thermally induced, i.e. by raising the temperature to 50 to 250° C. Alternatively, crosslinking can be radiation-induced by adding a photoacid. Moreover, such a buffer layer can be advantageously applied by means of printing techniques, especially inkjet printing, as the ideal temperature for the thermal treatment is independent of the glass transition temperature of the material. This avoids having to rely on material that has a low molecular weight, making it possible to apply the layer by means of printing techniques. The next layer (the organic semiconductor layer) can also be applied with the aid of different printing techniques, particularly inkjet printing, because the buffer layer is rendered insoluble by the crosslinking process, thus preventing the buffer layer from solubilizing thereafter.