Invention Grant
- Patent Title: Structures for dense, crack free thin films
- Patent Title (中): 密集,无裂纹薄膜的结构
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Application No.: US11567056Application Date: 2006-12-05
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Publication No.: US07901837B2Publication Date: 2011-03-08
- Inventor: Craig P. Jacobson , Steven J. Visco , Lutgard C. De Jonghe
- Applicant: Craig P. Jacobson , Steven J. Visco , Lutgard C. De Jonghe
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- Agency: Fulbright & Jaworski L.L.P.
- Main IPC: H01M8/10
- IPC: H01M8/10

Abstract:
The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.
Public/Granted literature
- US20070134532A1 Structures for dense, crack free thin films Public/Granted day:2007-06-14
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