Invention Grant
- Patent Title: Radiation-sensitive composition and method of fabricating a device using the radiation-sensitive composition
- Patent Title (中): 辐射敏感组合物和使用该辐射敏感组合物制造器件的方法
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Application No.: US10948826Application Date: 2004-09-23
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Publication No.: US07901864B2Publication Date: 2011-03-08
- Inventor: Wu-Song Huang , Marie Angelopoulos , Timothy A. Brunner , Dirk Pfeiffer , Ratnam Sooriyakumaran
- Applicant: Wu-Song Huang , Marie Angelopoulos , Timothy A. Brunner , Dirk Pfeiffer , Ratnam Sooriyakumaran
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Main IPC: G03C1/00
- IPC: G03C1/00 ; H01L21/00 ; G03F1/00

Abstract:
A radiation-sensitive composition (and method of fabricating a device using the composition) includes a nonpolymeric silsesquioxane including at least one acid labile moiety, a polymer including at least one member selected from the group consisting of an aqueous base soluble moiety and an acid labile moiety, and a radiation-sensitive acid generator. Another radiation-senstive composition (and method of fabricating a device using the composition) includes a nonpolymerc silsesquioxane including at least one aqueous base soluble moiety, a polymer including an aqueous base soluble moiety, a crosslinker, and a radiation-sensitive acid generator.
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