Invention Grant
- Patent Title: Resist composition and process for formation of resist patterns
- Patent Title (中): 抗蚀剂图案的抗蚀剂组成和工艺
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Application No.: US11574805Application Date: 2005-09-02
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Publication No.: US07901865B2Publication Date: 2011-03-08
- Inventor: Taku Hirayama , Daiju Shiono , Hideo Hada
- Applicant: Taku Hirayama , Daiju Shiono , Hideo Hada
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2004-260764 20040908
- International Application: PCT/JP2005/016113 WO 20050902
- International Announcement: WO2006/028014 WO 20060316
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/028 ; G03F7/039

Abstract:
A resist composition that includes a base material component (A), which contains acid-dissociable, dissolution-inhibiting groups and exhibits increased alkali solubility under the action of acid, an acid generator component (B) that generates acid on exposure, and an organic solvent (C), in which the components (A) and (B) are dissolved in the organic solvent (C), wherein the base material component (A) contains a protected form (A1) of a polyhydric phenol compound (a) having two or more phenolic hydroxyl groups and a molecular weight within a range from 300 to 2,500, in which either a portion of, or all of, the phenolic hydroxyl groups are protected with acid-dissociable, dissolution-inhibiting groups, and the organic solvent (C) comprises an alcohol.
Public/Granted literature
- US20080020288A1 Resist Composition and Process for Formation of Resist Patterns Public/Granted day:2008-01-24
Information query
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