Invention Grant
US07901953B2 Methods and apparatus for detecting defects in interconnect structures
失效
用于检测互连结构中的缺陷的方法和装置
- Patent Title: Methods and apparatus for detecting defects in interconnect structures
- Patent Title (中): 用于检测互连结构中的缺陷的方法和装置
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Application No.: US12205871Application Date: 2008-09-06
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Publication No.: US07901953B2Publication Date: 2011-03-08
- Inventor: Michael C. Smayling , Shiany Oemardani , Karl F. Smayling
- Applicant: Michael C. Smayling , Shiany Oemardani , Karl F. Smayling
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
In some aspects, a method is provided for detecting a void in a test structure that comprises (a) measuring a resistance of the test structure; (b) applying a stress to the test structure at increasing levels until at least one of: (i) the measured resistance of the test structure exceeds a predetermined resistance threshold; and (ii) the stress level reaches a predetermined stress maximum; (c) detecting a void if the measured resistance of the test structure exceeds the predetermined resistance threshold; and (d) determining that the test structure is void free if the stress level reaches the predetermined stress maximum without the measured resistance of the test structure exceeding the predetermined resistance threshold. Numerous other aspects are provided.
Public/Granted literature
- US20090066358A1 METHODS AND APPARATUS FOR DETECTING DEFECTS IN INTERCONNECT STRUCTURES Public/Granted day:2009-03-12
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