Invention Grant
- Patent Title: Solid state imaging device and manufacturing method thereof
- Patent Title (中): 固态成像装置及其制造方法
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Application No.: US12096005Application Date: 2006-12-11
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Publication No.: US07901973B2Publication Date: 2011-03-08
- Inventor: Kiyofumi Yamamoto
- Applicant: Kiyofumi Yamamoto
- Applicant Address: JP Tokyo
- Assignee: Fujifilm Corporation
- Current Assignee: Fujifilm Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2005-360949 20051214; JP2005-362325 20051215
- International Application: PCT/JP2006/325130 WO 20061211
- International Announcement: WO2007/069750 WO 20070621
- Main IPC: H01L21/78
- IPC: H01L21/78

Abstract:
To a transparent substrate (20) on which a plurality of spacers (5) are formed, an infrared cut filter (IRCF) substrate (27) is attached. The IRCF substrate (27) has a coefficient of thermal expansion smaller than the transparent substrate (20) and approximately equal to a wafer (31). Next, the transparent substrate (20) is diced into plural pieces to form a plurality of cover glasses (6). Then heat cure adhesive (32) is coated on each spacer (5) and the spacers (5) are attached on the wafer (31) on which a plurality of light receiving section (3) and pads (10) are previously formed. Finally, the heat cure adhesive (32) is heated to be cured.
Public/Granted literature
- US20090273047A1 SOLID STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-11-05
Information query
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