Invention Grant
US07901974B2 Masked laser anneal during fabrication of backside illuminated image sensors 有权
在制造背面照明图像传感器期间的掩模激光退火

Masked laser anneal during fabrication of backside illuminated image sensors
Abstract:
A technique for fabricating an array of imaging pixels includes fabricating front side components on a front side of the array. After fabricating the front side components, a dopant layer is implanted on a backside of the array. A mask is formed over the dopant layer to selectively expose portions of the dopant layer. Next, the exposed portions of the dopant layer are laser annealed. Alternatively, the mask may be disposed over the backside prior to the formation of the dopant layer and the dopants implanted through the exposed portions and subsequently laser annealed.
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