Invention Grant
- Patent Title: Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace
- Patent Title (中): 制造具有铝柱/基散热器和银/铜导电迹线的半导体芯片组件的方法
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Application No.: US12722526Application Date: 2010-03-12
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Publication No.: US07901993B2Publication Date: 2011-03-08
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: Charles W. C. Lin , Chia-Chung Wang
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agent David M. Sigmond
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48
Abstract:
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a copper layer on the adhesive including aligning the post with an aperture in the copper layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the copper layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a silver coating and a copper core that is a selected portion of the copper layer, mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
Public/Granted literature
Information query
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