Invention Grant
- Patent Title: Integrated circuit package system with interconnection support and method of manufacture thereof
- Patent Title (中): 具有互连支持的集成电路封装系统及其制造方法
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Application No.: US12484131Application Date: 2009-06-12
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Publication No.: US07901996B2Publication Date: 2011-03-08
- Inventor: Henry Descalzo Bathan , Il Kwon Shim , Jeffrey D. Punzalan , Zigmund Ramirez Camacho
- Applicant: Henry Descalzo Bathan , Il Kwon Shim , Jeffrey D. Punzalan , Zigmund Ramirez Camacho
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495
Abstract:
An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
Public/Granted literature
- US20090250798A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT SUPPORT Public/Granted day:2009-10-08
Information query
IPC分类:
