Invention Grant
- Patent Title: Detachable substrate with controlled mechanical strength and method of producing same
- Patent Title (中): 具有受控机械强度的可分离衬底及其制造方法
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Application No.: US10474984Application Date: 2002-04-11
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Publication No.: US07902038B2Publication Date: 2011-03-08
- Inventor: Bernard Aspar , Hubert Moriceau , Olivier Rayssac , Bruno Ghyselen
- Applicant: Bernard Aspar , Hubert Moriceau , Olivier Rayssac , Bruno Ghyselen
- Applicant Address: FR Paris
- Assignee: Commissariat A l'Energie Atomique
- Current Assignee: Commissariat A l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Brinks Hofer Gilson & Lione
- Priority: FR0105130 20010413
- International Application: PCT/FR02/01268 WO 20020411
- International Announcement: WO02/084722 WO 20021024
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
The invention relates to a method for production of a detachable substrate, comprising a method step for the production of an interface by means of fixing, using molecular adhesion, one face of a layer on one face of a substrate, in which, before fixing, a treatment stage for at least one of said faces is provided, rendering the mechanical hold at the interface at such a controlled level to be compatible with a subsequent detachment.
Public/Granted literature
- US20040222500A1 Detachable substrate with controlled mechanical hold and method for production thereof Public/Granted day:2004-11-11
Information query
IPC分类:
